Welcome to FLEX Japan, the first international flexible and printed electronics conference held in Tokyo, Japan on April 11-12, 2017! This conference brings together world leaders from the flexible and printed electronics industry in an environment conducive to formal and informal information-exchange, networking and business collaboration.
A table top exhibition will accompany the 2-days technical sessions and will be held in the same venue. Substantial networking opportunities include an event reception for meeting and enjoying time with colleagues.
The incorporation of FlexTech as a SEMI strategic partner has enabled the expansion of the FLEX Conference to Japan to promote and advance the technical and business interests of our members in flexible, printed and hybrid electronics worldwide.
The program will cover 4 key topic areas:
Tuesday, April 11th
- FHE & Printed Electronics Session
The FHE and printed electronics session is presented by veteran technology leaders who will share insights into overall industry research and trends. Hear from experts from the Air Force Research Laboratory (US), National Institute of Advanced Industrial Science and Technology (AIST) (Japan), Holst Centre (Netherlands) and Samsung Electronics (South Korea).
- IoT Application Session
The new applications within FHE will be presented by SECOM (Japan) on home securities, ThinFilm (Norway) on retail and distribution, and Wyzart (Japan) on industrial design. Watch industry experts discuss how FHE impacts their respective fields and their outlook for the future.
Wednesday, April 12
- MEMS and Sensors Session
Represented by Tohoku University (Japan), Goertek Technology (China), Tokyo University (Japan) and Dai Nippon Printing (Japan), these leading MEMS technology leaders will take a look at how MEMS and sensors play an integral role in the FHE field.
- Smart Textile Session
Companies and academic institutions from the United States and Japan share their latest findings on how to utilize textiles as a FHE substrate. Speakers include: Google (US), Cornell University (US), Tokyo Institute of Technology (Japan) and Goldwin (Japan).