The CAMM was established in 2005 when the Flex Tech Alliance (formerly the United States Display Consortium) selected Binghamton University, a global leader in electronics packaging and small scale systems integration, in partnership with Endicott Interconnect Technologies Inc, and Cornell University, to spearhead development of next generation roll-to-roll (R2R) electronics manufacturing capabilities. A unique collaborative effort, the CAMM brings together partners from government, industry and academia to tackle the myriad challenges of this emergent technology.
Polyera Corporation is a leading supplier in semiconductor, dielectric, and interfacial materials for the printed and flexible electronics industry. Polyera is focused on developing breakthrough materials for its portfolio of ActivInk™ products and on working closely with customers to provide deep technical support and customized solutions in order to enable the commercialization of novel printed and flexible electronic products.
pplied Materials, Inc. is the global leader in Nanomanufacturing Technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass.