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Novel & Innovative Power Sources for Lightweight, Mobile Devices & Wearable Electronics

Workshop/Training
Tuesday, September 29, 2015 - 1:00am to Wednesday, September 30, 2015 - 1:00am

Join FlexTech for a multi-market look at the power sources and
options for lightweight, mobile devices, including IoT and wearable
electronics. The combination of networking, presentations, and tours of a
state-of-the-art roll-to-roll manufacturing facility and S3IP
laboratories will provide excellent insights into the technology, market
and applications.

This workshop will focus on both military and
commercial applications of novel and innovative power sources. The
military has a few special requirements, but they run the gamut in sizes
and applications. Commercially, the focus is on powering devices for
wearable and mobile applications. Products that sip power are in high
demand. Attend this workshop and come away with an understanding of the
current views of researchers, designers and analysts.

Speakers Include:
Air
Force Research Lab, FlexTech Alliance, SUNY Binghamton, Marc Chason and
Associates, Inc., Lux Research, NovaCentrix, BessTech, Arizona State
University​

Who Should Attend

• Product and Component Designers

• Electronics Integrators

• Business Development Professionals in Consumer and Military Electronics

• EMS Companies

• Mobile Device Manufacturers

• Sensor Component Suppliers

• Conductive Materials and Functional Inks Companies

• Manufacturing Equipment Providers

• SuperCapacitors Researchers and Users

• Healthcare Device Designers and Integrators

• Electronic Printing Integrators

Company Tour (optional)

The program begins on Tuesday afternoon September 29th with a tour of the Center for Advanced Microelectronics Manufacturing (CAMM),
a partnership between Binghamton University (BU), Endicott Interconnect
Technologies (EI), Cornell University and the Flex Tech Alliance. The
CAMM is the nation’s first prototype research and development (R&D)
facility in large area flexible electronics. The CAMM is part of BU’s
New York State Center of Excellence in Small Scale Systems Integration
and Packaging (S3IP), which serves as an international resource for
systems integration and packaging R&D.

Networking Dinner (optional)

A no-host networking dinner following the tour
will provide introductions to industry colleagues and ample time to
exchange information.